Ghaffarian, Reza, Jet Propulsion Laboratory, California Institute of Technology Pasadena, California, USA, United States

• Vol 29, No 4 (2016) - INVITED PAPERS
  MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS
  Abstract  PDF

ISSN: 0353-3670 (Print)

ISSN: 2217-5997 (Online)

COBISS.SR-ID 12826626