Han, Yurim, Chung-Ang University, South Korea, Korea, Republic of

• Vol 20, No 3 (2022) - Articles
  BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS
  Abstract  PDF

ISSN: 0354-2025 (Print)

ISSN: 2335-0164 (Online)

COBISS.SR-ID 98732551

ZDB-ID: 2766459-4