THE USE OF FRACTIONAL CALCULUS FOR THE OPTIMAL PLACEMENT OF ELECTRONIC COMPONENTS ON A LINEAR ARRAY

Gilbert De Mey, Mariusz Felczak, Boguslaw Wiecek

DOI Number
-
First page
77
Last page
84

Abstract


Cooling of heat dissipating components became an important topic in the last decades. Sometimes a simple solution is possible, such a placing critital component closer to the fan outlet. On the other hand this component will heat the air which has to cool the other components further away from the fan outlet. If a substrate bearing a one dimensional array of heat dissipating components, is cooled by forced convection only, an integral equation relating temperature and power is obtained. The forced convection will be modelled by a simple analytical wake function. It will be demonstrated that the integral equation can be solved analytically using fractionol calculus.

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References


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ISSN: 0353-3670 (Print)

ISSN: 2217-5997 (Online)

COBISS.SR-ID 12826626