Ceric, Hajdin, Christian Doppler Laboratory for Reliability Issues in Microelectronics at the Institute for Microelectronics, TU Wien, Austria Institute for Microelectronics, TU Wien, Gußhausstraße 27–29, A-1040 Wien, Austria, Austria

• Vol 27, No 1 (2014) - INVITED PAPERS
  MICROSTRUCTURAL IMPACT ON ELECTROMIGRATION: A TCAD STUDY
  Abstract  PDF

ISSN: 0353-3670 (Print)

ISSN: 2217-5997 (Online)

COBISS.SR-ID 12826626